Skip to content
HomeSolutionsDell TechnologiesDell PowerEdge R770 — Direct Liquid-Cooled Dual Xeon 6 HPC Node
Dell Technologies logo
Dell Technologies

Dell PowerEdge R770 — Direct Liquid-Cooled Dual Xeon 6 HPC Node

Liquid-cooled 2U compute node for dense HPC and simulation clusters

Full manufacturer warrantyAuthorized channel48-hour quote

We help you choose, configure, and deliver the right system — no obligation.

Dell PowerEdge R770 — Direct Liquid-Cooled Dual Xeon 6 HPC Node — Dell Technologies enterprise hardware
Dell Technologies logo
Dell PowerEdge R770 — Direct Liquid-Cooled Dual Xeon 6 HPC Node hardware detail 1
Dell PowerEdge R770 — Direct Liquid-Cooled Dual Xeon 6 HPC Node hardware detail 2
Dell PowerEdge R770 — Direct Liquid-Cooled Dual Xeon 6 HPC Node hardware detail 3

Configuration at a Glance

CPU2x Intel Xeon 6 P-core, up to 86 cores each
CoolingDell Direct Liquid Cooling (DLC) heatsinks
MemoryUp to 8TB DDR5 RDIMM at 6400 MT/s (1DPC)
StorageNVMe Gen5 scratch SSDs plus BOSS-N1 boot

Tailored per engagement. Full technical overview below.

Configuration Options

Core specifications for this system. Every component is configurable to your workload — request a quote for a tailored build.

Processor

2x Intel Xeon 6 P-core, up to 86 cores each

Memory

Up to 8TB DDR5 RDIMM at 6400 MT/s (1DPC)

Storage

NVMe Gen5 scratch SSDs plus BOSS-N1 boot

Overview

This PowerEdge R770 is specified with high-core Intel Xeon 6 processors and Dell's Direct Liquid Cooling heatsinks for sustained high-clock performance in space- and thermally-constrained datacenters. Every node is configured, thermally validated, and warranty-backed through Dell authorized channels.

Who This Solution Is For

HPC and research computing teams
CFD, FEA and simulation engineering groups
Quantitative research and modeling desks
Facilities standardizing on liquid cooling

Business Benefits

Sustained turbo clocks

Direct liquid cooling holds high all-core frequencies for tightly-coupled HPC jobs that air cooling throttles.

Rack and power density

Liquid heatsinks let high-TDP CPUs run in 2U, improving compute per rack unit and PUE.

Cluster-ready core count

Up to 172 P-cores per node accelerates parallel solvers and shrinks job wall-clock time.

Typical Business Use Cases

1

Computational fluid dynamics solvers

2

Finite element and crash simulation

3

Genomics and bioinformatics pipelines

4

Tightly-coupled MPI cluster nodes

Industry Applications

HPCManufacturingHigher Education & ResearchHealthcare & Life Sciences

Technical Overview

The R770 leverages Intel Xeon 6 Granite Rapids P-core silicon with eight DDR5 channels per socket and a factory Direct Liquid Cooling heatsink option rated for the platform's highest-TDP SKUs. Liquid-to-the-chip cooling sustains boost frequencies under continuous all-core load typical of HPC simulation.

CPU2x Intel Xeon 6 P-core, up to 86 cores each
CoolingDell Direct Liquid Cooling (DLC) heatsinks
MemoryUp to 8TB DDR5 RDIMM at 6400 MT/s (1DPC)
StorageNVMe Gen5 scratch SSDs plus BOSS-N1 boot
Networking/FabricPCIe Gen5 200/400Gb HDR/NDR fabric options
Form Factor2U rack, dual-socket
ManagementiDRAC10 with telemetry streaming
PowerRedundant Titanium hot-plug PSUs
WarrantyDell ProSupport for HPC, multi-year

Specifications are indicative and configured to each engagement. Request a quote for a configuration tailored to your requirements.

Warranty, Support & Fulfillment

Every system ships from an authorized channel, configured and tested, with the documentation enterprise buyers need — backed by warranty and a dedicated account team.

Enterprise Warranty

Full manufacturer warranty with optional on-site, next-business-day support and extended coverage.

Authorized Channel

Sourced through Tier-1 distribution and OEM partners — never grey market. Asset & warranty records included.

Lead Time & Deployment

48-hour quotes, then configured, burn-in tested, and delivered on a committed schedule.

Nationwide Fulfillment

Coordinated logistics, rack-and-stack, and delivery wherever your infrastructure lives.

Frequently Asked Questions

Do we need rack-level liquid cooling infrastructure?

Direct Liquid Cooling requires a coolant distribution unit or facility loop; we help scope rack manifolds and CDU compatibility during configuration.

Why liquid cooling instead of air for HPC?

Liquid cooling sustains the highest CPU boost clocks under continuous all-core load and enables denser, more energy-efficient racks than air at the same TDP.

Hardware Assistance

Configure the Dell PowerEdge R770 — Direct Liquid-Cooled Dual Xeon 6 HPC Node with Nexus Compute

Tell us your requirements and a hardware specialist will help you specify, configure, and quote the right system — typically within two business days. No obligation.